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jgn1104ls - ar plcc - 2 type, ired peak wavelength : 850nm outer dimension 3.5 x 2.8 x 1.9mm( l x w x h ) standard product reference sheet features package recommended applications page : 1 product features ? right source for various sensors, touch panels, and security equipment etc. ? wide range t emperature applicable product ? high reliability (for automotive applications, other high - reliability required applications and general applications) ? lead C free soldering compatible ? rohs compliant 2016.4.15
jgn1104ls - ar unit mm tolerance 0.2 outline dimensions unit mm weight 33mg tolerance 0.2 recommended pad page : 2 2016.4.15 symbol part name materials qty. led die gaalas 1 lamp housing white resin 1 terminal au/pd plating 2 encapsulant silcorn resin 1
jgn1104ls - ar specifications page : 3 2016.4.15 note3 rth(j-a) measurement condition thermal characteristics thermal resistance junction - ambient r th(j-a) /w note3 thermal resistance junction - solder point r th(j-s) /w soldering temperature "reflow soldering" electrostatic discharge threshold "hbm" 1,000 v -40 +120 note 1 note 2 esd testing method : eiaj4701/300(304) human body model(hbm) 1.5k,100pf units 260 (ta=25 ) please refer to page 8, soldering conditions. symbol tj item junction temperature i frm 1,000 t opr reverse voltage v r 5 i f 100 ma i frm 28.6 ma/ 180 repetitive peak forward current "0.1ms,1/100duty" (ta=25 ) water clear gaalas product overview resin color (emitting area) power dissipation p d i frm derate linearly from "85 " die material ma i f derate linearly from "85 " note2 resin color (lamp housing) item symbol maximum ratings units mw esd storage temperature t stg -40 +100 note1 white forward current v t sld i f 2.86 ma/ absolute maximum ratings operating temperature pattern size : 16mm 2 typ. max. 150 110 - 120 - - substrate : fr4 (t=1.6mm)
jgn1104ls - ar specifications page : 4 2016.4.15 ?y 5.0 - 35 pf i f = 50ma v r = 5v - a 850 ns i f = 50ma 100 - - mw - v nm max. 1.50 item conditions v f 1.75 (ta=25 ) i f = 50ma units - radiant intensity po reverse current total power 820 forward voltage min. typ. 1.25 electro and optical characteristics symbol - p mw/sr nm i r i f = 50ma i e 880 14.0 9.2 note4 - deg. response time (rise) peak wavelength half intensity angle i f = 50ma note 4 viewing angle at 50% iv, ?x ; housing long side axis, ?y ; housing short side axis 120 ?x above the table of radiant intensity (i e ) values and peak wavelength (p) values are the setup value of the selection machine tolerance i e 10% p 1nm 120 spectral line half width ? i f = 50ma - 35 - capacitance co v=0v,f=1mhz - 23 - tr i f = 50ma 13 - ns - response time (fall) tf i f = 50ma 13 - - led's shall be sorted out into the following ranks of radiant intensity. i e (mw/sr) i f =50ma ta=25 shipment the each shipping lot shall consist of mixed rank (a,b) and the quantity of leds in each rank can not be specified. sorting chart for radiant intensity 7.0 5.0 10.0 a b 14.0 radiant intensity (i e ) rank min. max. rank conditions
jgn1104ls - ar 0 50 100 -100 -50 0 50 100 relative radiant intensity (%) - 30 - 60 - 90 60 30 0 90 50 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 700 750 800 850 900 950 1000 1050 1100 relative radiant intensity technical data spatial distribution conditions: ta = 25 , i f =50ma x direction y direction x y relative intensity vs. wavelength conditions: ta = 25 , i f =50ma wavelength (nm ) page : 5 2016.4.15
jgn1104ls - ar 0.1 1 10 -40 -20 0 20 40 60 80 100 0.01 0.1 1 1 10 100 1 10 100 1.2 1.3 1.4 1.5 1.6 1.7 1.3 1.4 1.5 1.6 -40 -20 0 20 40 60 80 100 forward current vs. relative radiant intensity condition : ta = 25 forward current i f ( ma) relative radiant intensity forward voltage vs. forward current condition : ta = 25 forward voltage v f ( v) ambient temp. vs. forward voltage condition : i f = 50ma ambient temp. : ta ( ) forward current i f (ma) ambient temp. vs. relative intensity condition : i f = 5 0ma ambient temp. : ta ( ) relative radiant intensity technical data forward voltage v f (v) page : 6 2016.4.15
jgn1104ls - ar 0.01 0.1 1 10 100 1 10 100 1,000 1 10 100 1,000 1.0 2.0 3.0 0 200 400 600 800 1,000 1,200 -40 -20 0 20 40 60 80 100 120 duty=1% duty=5% duty=50% duty=20% duty=10% dc 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 pulse forward current vs. relative radiant intensity conditions : tw Q 100 s, duty Q 1/100, ta=25 pulse forward current : i frm ( ma) ambient temperature vs. maximum forward current condition : tw Q 0.1msec ambient temp. : ta ( ) ambient temperature vs. forward current ambient temperature : ta ( ) pulse forward voltage vs. pulse forward current conditions :ta=25 , tw Q 100 s, duty Q 1/100 pulse forward voltage : v fm ( v ) pulse forward current : i frm (ma) forward current : i f . (ma) relative radiant intensity technical data max forward current i f max.(ma) page : 7 2016.4.15
jgn1104ls - ar 0 200 400 600 800 1,000 1,200 -40 -20 0 20 40 60 80 100 120 10 100 1,000 10,000 0.001 0.01 0.1 1 0 20 40 60 80 100 120 140 160 180 200 -40 -20 0 20 40 60 80 100 120 ambient temperature vs. pulse forward current conditions : tw Q 100 s, duty Q 1/100 ambient temperature : ta ( ) ambient temperature vs. power dissipation ambient temp. : ta ( ) duty ratio vs. pulse forward current conditions : ta=25 , tw Q 100 s duty ratio pulse forward current : i frm ( ma ) power dissipation : pd ( mw ) technical data pulse forward current : i frm ( ma ) page : 8 2016.4.15
jgn1104ls - ar page : 9 soldering condition 1. heat stress during soldering will influence the reliability of leds, however that effect will vary on heating method. also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount led). 2. led parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials . 3. recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. temperature distribution varies on heating method, pcb material, other components in the assembly, and mounting density. please do not repeat the heating process in reflow process more than twice. note 1 recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. this should be the maximum temperature for soldering. lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability . note 2 the reflow soldering process should be done up to twice(2 times max). when second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of led. the second soldering process should not be done until leds have returned to room temperature (by nature - cooling) after first soldering process. soldering precaution ( acc.to eiaj - 4701/300 ) page : 9 2016.4.15 recommended reflow soldering condition 40sec max. 150 180 +1.5 +5 /s 260 max. - 1.5 - 5 /s 90~ 120sec max. pre - heating (soldering 230 max. peak temperature
jgn1104ls - ar soldering condition 4. if soldering manually, stanley recommends using a soldering iron equipped with temperature control. during the actual soldering process , make sure that the soldering iron never touch the led itself, and avoid the led's electrode heating temperature reaching above the heating temperature of the solder pad. all repairs must be performed only once in the same spot, and please avoid reusing components. 5. in soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature before using. also, please avoid applying any type of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. when using adhesive material for tentative fixatives, thermosetting resin or ultraviolet radiation (uv) setting resin with heat shall be recommended . the curing condition, temperature:150 max./time:120sec.max. 7. flow soldering (dip soldering) is not recommended for this product . 8. lsopropyl alcohol is recommended for cleaning. some chemicals, including freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. please review the reference chart below for cleaning. if water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. recommended manual soldering condition temperature of iron tip 350 max. soldering duration, time 3sec.max.,1 time chemical adaptability isopropyl alcohol trichloroethylene chlorothene acetone thinner page : 10 2016.4.15
jgn1104ls - ar 1. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions 2. absolute maximum ratings are set to prevent led lamps from failing due to excess stress ( temperature , current, voltage, etc .). usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously . 3. in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken into account for designing. ( derating of typ., max forward voltage, etc.) 4. please insert protective resistors into the circuit in order to stabilize led operation and to prevent the device from igniting due to excess current . 5. please avoid the stick of foreign material because molding resin in the products have adhesiveness. also please don't touch lens portion. 6. please check the actual performance in the assembly because the specification sheets are described for led device only. 7. please refrain from looking directly at the light source of led at high output, as it may harm your vision. 8. the products are designed to operate without failure in recommended usage conditions. however, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise . 9. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 10. when there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). please make sure there is no problem before using . 11. the formal specification sheets shall be valid only by exchange of documents signed by both parties. handling precaution other precautions page : 11 2016.4.15
jgn1104ls - ar 1. picking up point with nozzle: lamp housing of the product ( area) ( shown below) recommendation the picking up point should be within lamp housing portion, because the silicone resin used for the lens is soft. (if the nozzle makes contact with the lens, the products might be destroyed) handling precaution handling precautions for product mounting please adjust the load, the pick up point, the nozzle diameter, etc. before mounting because the over load can cause the breakage of the lamp housing. a b max. 2. recommended nozzle shape nozzle with chamfering is recommended load : less than 10n (to avoid the product breaking) page : 12 2016.4.15
jgn1104ls - ar packaging specifications this product is baked (moisture removal) before packaging, and is shipped in moisture - proof packaging (as shown below) to minimize moisture absorption during transportation and storage. however, with regard to storing the products, stanley recommends the use of dry - box under the following conditions is recommended. moisture - proof bag as the packaging is made of anti - static material but packaging box is not. the package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering as is maximum 4weeks(672h) . if the device needs to be soldered twice, both soldering operations must be completed within the 4weeks(672h). if any components should remain unused, please reseal the package and store them under the conditions described in the recommended storage condition above . this product must be required to perform baking process (moisture removal) for at 48h( min.). 72 h (max .) at 60 5 degrees celsius if following conditions apply. 1. in the case of silica gel (blue) which indicates the moisture level within the package, changes or loses its blue color. 2 . in the case of time passes for 4weeks(672h) after the package is opened once . baking process should be performed after led having been taken out of the package . baking may be performed in the tape - reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. please handle only once it has returned to room temperature. provided that, baking process shall be 2 times max. time elapsed after package opening in the case of the package unopened , 6 months under recommended storage condition . please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. recommended storage condition / products warranty period temperature +5 30 humidity under 70% page : 13 2016.4.15
jgn1104ls - ar packaging specification moisture - proof packaging specification fastener for re - storage after opening bag customer's opening position product label (desiccant with indicator for moisture level is enclosed .) a heat sealing position (after product being put in) allowable leaving time means the maximum allowable leaving time after opening package, which depends on each led type. the allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. when judging if the allowable leaving time has exceeded or not, please subtract the soldering time. the allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. flow chart - package opening to mounting page : 14 2016.4.15 symbol part name matelrial remarks moisture-proof bag with aluminum layer pet+al+pe with esd protection yes no yes no yes no baking led under recommended condition product mounting unused-product remained return to moisture-proof package and seal finished reopen the moisture-proof package flow chartpackage opening to mounting stored under recommended condition moisture-proof package first time opening allowable leaving time exceeded (*) discoloration of silica gel
jgn1104ls - ar packing box ( rohs ? elv compliant) the above measures are all the reference values. the box is selected out of the above table by shipping quantity. packaging specifications type a material / box cardboard c5bf type b,c material / box cardboard k5af partition cardboard k5af box type outline dimension l w h (mm) capacity of the box type a 280 265 45 (mm) 3 reels type b 310 235 265 (mm) 15 reels type c 440 310 265 (mm) 30 reels page : 15 2016.4.15 no. part name material remarks packing box corrugated cardbord without esd protection
jgn1104ls - ar label specification ( acc.to jis - x0503(code - 39 ) product label a. parts number b . bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e . bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g. bar - code for lot number & rank opto device label a. customer name b. parts type c. parts code d. parts number e. packed parts quantity f. carton number g. shipping date h. bar - code for in - house identification number < remarks> bar - code font : acc.to code - 39(jix0503) packaging specifications b a page : 16 2016.4.15
jgn1104ls - ar taping and reel specifications (acc.to jis - c0806 - 03 appearance note - ar means ode s ide of leds should be placed on the sprocket - hole side. items specifications remarks leader area cover - tape cover - tape shall be longer than 320mm without carrier - tape the end of cover - tape shall be held with adhesive tape. carrier - tape empty pocket shall be more than 20 pieces. please refer to the above figure for taping & reel orientation . trailer area empty pocket shall be more than 15 pieces. the end of taping shall be inserted into a slit of the hub. direction to take out page : 17 2016.4.15
jgn1104ls - ar taping and reel specifications ( acc.to jis - c0806 - 03 qty . per reel mechanical strength others 2 , 000parts/reel minimum qty. per reel might be 500 parts when getting less than 2,000 parts. in such case, parts of 500 - unit - qty. shall be packed in a reel and the qty . shall be identified on the label. cover - tape adhesive strength shall be 0.1 1.0n ( an angle between carrier - tape and cover - tape shall be170 deg. ) both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. qty./reel max. qty. of empty pocket remarks 500 1 - 1,000 1 - 1,500 1 - 2,000 2 no continuance reversed - orientation, up - side down placing, side placing and out of spec. parts mixing shall not be held. max. qty. of empty pocket per reel shall be defined as follows. page : 18 2016.4.15
jgn1104ls - ar taping dimensions reel dimensions taping and reel specifications ( acc.to jis - c0806 - 03 unit mm page : 19 2016.4.15 carrier-tape with esd protection cover-tape with esd protection with esd protection carrier-reel symbol part name remarks
jgn1104ls - ar lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 20099,20100,20111, ??? ) - 2digits production month (jan. to sep. , should be 01,02,03, ????? ) - 2digits production date - 3digits serial number - 2digits tape and reel following number - 2digits luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2digits chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) page : 20 2016.4.15
jgn1104ls - ar page : 21 correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 21 2016.4.15
jgn1104ls - ar reliability testing result 1. reliability testing result page : 22 2. failure criteria 2016.4.15 ta=60 rh=90% eiaj ed-4701 /100(102) 1,000h 1,000h 0 / 20 1,000h 1,000h eiaj ed-4701 /200(201) ta=60 rh=90% i f =100ma 0 / 20 low temperature storage life room temperature operating life eiaj ed-4701 /100(101) . m?YY / reliability testing result eiaj ed-4701 /100(101) ta=-40 i f =100ma temperature humidity operating life test item eiaj ed-4701 /100(101) human body model electrostatic discharge eiaj ed-4701 /300(304) c=100pf r2=1.5k 2,000v resistance to soldering heat ta=25 i f =100ma high temperature storage life high temperature operating life duration test condition reference standard failure ta=-40 120 (each 15min) 0 / 20 ta=-40 0 / 20 1,000h 0 / 20 wet high temperature storage life thermal shock 0 / 20 ta=120 0 / 20 low temperature operating life eiaj ed-4701 /100(101) eiaj ed-4701 /200(202) eiaj ed-4701 /100(105) twice 1,000h reference test 1,000 cycles eiaj ed-4701 /300(301) 2h of each direction 0 / 20 eiaj ed-4701 /400(403) vibration moisture soak ta=30 , rh=70% 4weeks(672h) preheating 150 180 90 120s. soldering 260 peak 98.1m/s 2 (10g) 100 2000hz 20min sweep xyz direction 0 / 10 0 / 10 once of each ta=100 i f =57ma 0 / 20 1,000h v f R [initial value]1.2 i f =50ma i e Q [initial value]0.5 i f =50ma v r =5v i r i r R [standard max. value] 2.5 reverse current condition relative radiant intensity i e forward voltage v f symbol item failure criteria
jgn1104ls - ar special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 23 2016.4.15

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